XPS BOARD PRODUCTION

Lengthwise/Transverse Profiling in XPS Multilayer Line

Starting at the non-driven cooling zone up to the bundle stacking unit for the finished panels, Bürkle supply the whole range including all components for state-of-the-art XPS extrusion systems with a capacity of up to 2,000 kg/h from a single source. Downstream packing elements can be integrated into the plant and control concept at request, so that there is only one point of contact serving you with the entire profiling and packing line.

In addition to this, Bürkle supply system solutions for the production of thicker XPS boards without the use of adhesives as well as various stations for upgrading XPS boards.

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